Semiconductor Back-End Process: Understanding the Different Types of Semiconductor Packages
Stacked Packages
Imagine a housing complex consisting of numerous low-rise buildings for thousands of people. It would require a very large area to accommodate the residents. However, the same number of residents could fit in a single skyscraper. This example clearly shows one of the key benefits of stacked packages. Compared to a product made with multiple packages spread horizontally across a wide area, a product consisting of stacked packages offers enhanced performance within a much smaller space. In addition to being an important packaging technology, stacked packaging is also an essential method in product development.
It used to be common for products to have only one chip per package, but it is now possible to develop a multi-chip package that has different functions or to place multiple memory chips in a single package that has an increased capacity. Furthermore, the development of SiP has allowed various system components to be implemented in a single package. Such technologies have enabled semiconductor companies to create high value-added products while also responding to the diverse needs of the market.
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